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Semiconductors

半导体

Counterpoint在驱动智能设备的底层技术及半导体方面，输出了独特的视角和深入的研究。从以下几个方面追踪这些零部件的情况，对整个产业的价值链而言是至关重要的。

  • 了解用以驱动多种功能 ，并支持以设备为中心的高级使用案例的技术。如高分辨率成像、更快的内容流媒体功能、人工智能等。
  • 了解不同品牌对不同零部件的采用情况 ，从而评估竞争力。
  • 通过准确识别零部件的成本趋势，以了解设备的物料清单(BoM)。
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近期研究

Counterpoint Conversations: Micron’s UFS 4.0 Memory Enabling Next-Gen AI Experiences at the Edge

  • Blog / PR
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  • Team Counterpoint

In the era of on-device AI, smartphones are transforming into powerful edge computing devices. This shift demands a significant leap in storage and high-speed transfer capabilities to handle the increasing demands of these complex AI models. Micron, a leading memory and storage innovator, is spearhe ...

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counterpoint micron ufs 4.0 interview

Global Smartphone AP-SoC Market Share: Quarterly

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Our quarterly data for global smartphone chipsets market share. This data is based on smartphone AP/SoC shipment numbers. Counterpoint Quarterly Semiconductors Q4 2023 Sign up to get access to the report. SIGN UP Global Smartphone AP (Application Processor) Shipments Market Share: Q3 2022 to Q4 2023 Published Date: Mar 11, 2024 Receive quarterly updates in your email Brands Q3 2022 Q4 2022 Q1 2023 ...

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Top 5 Wafer Fab Equipment Makers’ Revenue Declined 1% YoY in 2023; ASML on Top

  • Blog / PR
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Top 5 wafer fab equipment manufacturers’ revenue declined to $93.5 billion in 2023. Revenue from the foundry segment grew 16% YoY in 2023. Shipments to China accounted for around one-third of total system sales in 2023. Revenue from the memory segment fell 25% YoY in 2023 on a weak NAND end market. Technology upgrades in NAND and strong DRAM will help memory revenue growth in 2024. Strong DUV and ...

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Global Smartphone AP-SoC Shipments Tracker by Model

This report tracks the smartphone AP/SoC Shipments by Model for all the vendors. The scope of this report is from the AP/SoC shipments from all the key vendors like Apple, Qualcomm, MediaTek, Huawei, Samsung, and UNISOC. We have covered all the main models starting from Q1 2020 to Q2 2021.
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Global Smartphone AP-SoC Shipments Tracker by Model

This report tracks the smartphone AP/SoC Shipments by Model for all the vendors. The scope of this report is from the AP/SoC shipments from all the key vendors like Apple, Qualcomm, MediaTek, Huawei, Samsung, and UNISOC. We have covered all the main models starting from Q1 2020 to Q2 2021.
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Smartphone DRAM Status Update, 2020 Q4

Reports / May 13, 2021 / Brady Wang, Siddharth
DRAM densities in smartphones are growing fast to cater to customer tastes, such as life-like gaming experience and crystal-clear photography. Smartphones need additional resources to support the surging demand of users, and DRAM proves to be a critical component here.
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BoM Analysis for Apple iPhone 12 Pro Max Sub-6GHz

Reports / Sep 11, 2021 / Ethan Qi
The report is an extended analysis of the Bill of Materials covering the components that constitute the iPhone 12 Pro Max (Sub-6GHz). This will help in understanding the cost structure of the iPhone 12 series.
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查看半导体的所有研究

我们的半导体研究服务项目

智能手机 AP/SoC 服 务
显示器和摄像头传感器研究
半导体存储研究
晶元代工研究
零部件价格分析服务
BoM 成本分析

我们的意见领袖半导体领域的意见领袖

Neil Shah

Vice President

Tom Kang

Research Director​

Ethan Qi

Associate Director

Gareth Owen

Associate Director

Brady Wang

Associate Director

Mohit Agrawal

Associate Director

Sujeong Lim

Associate Director

Jene Park

Senior Analyst

William Li

Senior Analyst

Ivan Lam

Senior Analyst

Ashwath Rao

Senior Analyst

Parv Sharma

Senior Analyst

我们的意见领袖半导体领域的意见领袖

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